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Mellanox ConnectX-6 VPI Single Port 100 Gb/s EDR Infiniband Adapter Card for OCP 3.0 SFF - Part ID: MCX653435A-EDAI

SKU: MCX653435A-EDAI
Manufacturer: Mellanox
ConnectX-6 VPI Adapter Card HDR100 EDR IB and 100GbE for OCP with Host Management Single-Port QSFP56 PCIe 4.0 x16 Internal Lock, OCP 3.0 SFF More details...
Price: $680.00
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Mellanox ConnectX-6 VPI Single Port 100 Gb/s EDR Infiniband Adapter Card for OCP 3.0 SFF - Part ID: MCX653435A-EDAI
 
Product Details
Mellanox ConnectX®-6 InfiniBand Smart Adapter Cards for Open Compute Project (OCP)

Mellanox smart adapter cards deliver industry-leading connectivity for performance-driven server and storage applications. ConnectX adapter cards offer high bandwidth coupled with ultra-low latency and in-network computing to enable faster access and real-time responses. Mellanox offers a variety of OCP Spec 2.0 and OCP Spec 3.0 compliant adapter cards, providing best-in-class performance and efficient computing through advanced acceleration and offload capabilities. These advanced capabilities free up valuable CPU cores for other tasks, while increasing data center performance, scalability and efficiency, include:
  • IBTA Remote Data Memory Access (RDMA)
  • NVMe-over-Fabrics (NVMe-oF) offloads
  • In-network computing and MPI operation accelerations
  • Single Root IO Virtualization (SR-IOV)
  • GPUDirect® communication acceleration
  • Mellanox Multi-Host® for connecting multiple compute or storage hosts to a single interconnect adapter card
  • Enhanced security solutions

Open Compute Project
The OCP NIC 3.0 specification extends the capabilities of OCP NIC 2.0 design specification. OCP 3.0 defines a different form factor and connector style than OCP 2.0. The OCP 3.0 specification defines two basic card sizes: Small Form Factor (SFF) and Large Form Factor (LFF). Mellanox OCP NICs are currently supported in a SFF.*

OCP 3.0 provides additional board real estate, thermal capacity, electrical interfaces, network interfaces, host conflagration and management. OCP 3.0 also introduces a new mating technique that simplifies FRU installation and removal, and reduces overall downtime.

* Future designs may utilize LFF to allow for additional PCIe lanes and/or network ports


Benefits
  • Open Data Center Committee (ODCC) compatible
  • Compliant with OCP 3.0 NIC specifications
  • All platforms: x86, Power, Arm, compute and storage
  • Industry-leading performance
  • RDMA and TCP/IP for I/O consolidation
  • SR-IOV technology: VM protection and QoS
  • Increased Virtual Machine (VM) count per server

Target Applications
  • High Performance Computing (HPC)
  • Machine Learning, Artificial Intelligence (AI)
  • Compute and storage platforms
  • Data center virtualization
  • Clustered databases and high-throughput data warehousing
  • Latency-sensitive financial analysis and high frequency trading

Manufacturer Warranty
1 Year

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